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      NXP Semiconductors 1PS79SB30 Schottky barrier single diode 1PS79SB30 All information provided in this document is subject to legal disclaimers. ? NXP B.V. 2012. All rights reserved Product data sheet 24 July 2012 5 / 8 10. Soldering Footprint information for reflow soldering of plastic surface-mounted, 2 leads package SOD523 sod523_fr occupied area solder land solder resist solder land plus solder paste solder paste deposit Dimensions in mm 0.5 0.6 ×) (2×) (2 2.15 1.4 0.4 (2×) 0.5 (2×) 1.2 Fig. 5. Reflow soldering footprint for SOD523 (SOD523) 11. Revision history Table 8. Revision history Data sheet ID Release date Data sheet status Change notice Supersedes 1PS79SB30 v.2 20120724 Product data sheet - 1PS79SB30 v.1 Modifications: ? The format of this document has been redesigned to comply with the new identity guidelines of NXP Semiconductors. ? Legal texts have been adapted to the new company name where appropriate. ? Section "Product profile" updated ? Section "Marking" added ? Package outline drawing replaced by minimized package ouline drawing ? Section "Test information" added ? Section "Soldering" added 1PS79SB30 v.1 20010220 Product data sheet - - |